Services
IC Packaging


We offer IC package design services for emerging design technologies like Flip Chip , stacked die,POP ,PIP in addition to wire bond technology for mixed signal and RF-IC products. As high speed communications data rate is going up ,IC packaging become a critical design parameter. The interconnect(substrate) design of IC Packages needs high care and expertise, as the signal and power integrity of the substrate is crucial due to high frequency signals and low power of operation. We have inhouse capability to perform parasitic analysis, Simultaneous switching noise and IBIS modeling and mechanical simulations.The main package design service categories are CSP, Wire Bond BGA, Flip Chip BGA and other vertical space transformers (MLO/MLC) for ATE testing applications.

Wire Bond
  • Low Cost and Easy Assembly Process
  • 2 - 6 Layer Substrate designs
Not good for high power or number of I/Os
Not good for very high frequency of operation due to wire inductance
Flip Chip
  • Highest I/O count possible
  • Assembly cost independent of number of I/Os
  • Usage of Blind and Buried vias to reduce the substrate layers and package size
  • Ideal for CPU, GPU and Network Processors operating at high frequencies
  • Good Signal and Power Integrity due to reduced interconnect Inductance and Optimal Signal/Power/Ground ratio
Signal and Power Integrity Analysis
  • Reflection and Ringing Analysis
  • Single and Differential crosstalk Analysis
  • Net- wise radiated EMI Analysis
  • I/O supply noise (SSN) and Core Supply Noise Analysis
  • De-coupling Capacitors Estimation
  • MGH channel analysis for serial communication
Electrical Modeling
Parasitic RLC Extraction
  • IBIS and S-parameter Model
Substrate Manufacturing and Assembly
  • Experienced CAM team validates the design for Fab house DFM specifications
  • Strict adherence to assembly specifications
  • Coordination with assembly house and substrate foundry to achieve first time right substrate
Please contact us to receive free consultation over IC packaging design.